Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Heftet /
2012
/ Engelsk
Produktdetaljer
ISBN
9781461349891
Publisert
2012-10-14
Utgiver
Springer-Verlag New York Inc.
Høyde
235 mm
Bredde
155 mm
Aldersnivå
Research, P, 06
Språk
Product language
Engelsk
Format
Product format
Heftet
From the reviews: "Fatigue Life Prediction of Solder Joints in Electronic Packages ... excites the interest of engineers and allows them to conduct fatigue reliability analysis of solder joints. ... there must by now be this book on the bookshelf of every one concerned with fatigue reliability analyses of solder joints which is an important issue in the electronics industry." (Current Engineering Practice, Vol. 47, 2002-2003)
<strong>Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS®</strong> describes the method in great detail starting from the theoretical basis.
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Produktdetaljer
ISBN
9781461349891
Publisert
2012-10-14
Utgiver
Springer-Verlag New York Inc.
Høyde
235 mm
Bredde
155 mm
Aldersnivå
Research, P, 06
Språk
Product language
Engelsk
Format
Product format
Heftet