The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
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The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects.
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Interconnects.- Carbon Nanotube – Properties and Applications.- Modeling of Carbon Nanotube Interconnects.- Crosstalk and Delay Analysis.- Mixed Carbon Nanotube Bundle.- References.
Introduces carbon nanotube basics in lucid manner Discusses applications of carbon nanotube as VLSI interconnects Details modeling of CNTs as interconnects Includes supplementary material: sn.pub/extras
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GPSR Compliance The European Union's (EU) General Product Safety Regulation (GPSR) is a set of rules that requires consumer products to be safe and our obligations to ensure this. If you have any concerns about our products you can contact us on ProductSafety@springernature.com. In case Publisher is established outside the EU, the EU authorized representative is: Springer Nature Customer Service Center GmbH Europaplatz 3 69115 Heidelberg, Germany ProductSafety@springernature.com
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Produktdetaljer

ISBN
9788132220466
Publisert
2014-11-11
Utgiver
Vendor
Springer, India, Private Ltd
Høyde
235 mm
Bredde
155 mm
Aldersnivå
Research, P, 06
Språk
Product language
Engelsk
Format
Product format
Heftet

Biographical note

Brajesh Kumar Kaushik is currently working as Associate Professor in Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, India. Dr. Kaushik has completed his PhD from Indian Institute of Technology Roorkee in 2007. His research interests include Signal Integrity, Propagation Delay, and Power Dissipation of VLSI Interconnects; Low Power VLSI Design; Electronic Design Automation (EDA)-Circuit and Systems-CAD. Dr. Kaushik has authored more than 60 papers in peer reviewed international journals and over 80 papers in international Conferences. He has also authored many book chapters, which includes 3 chapters in Springer books. Dr. Kaushik is also an Editor-in-Chief of VLSI Design & Communication System (VLSICS) and Editor of Journal of Electrical and Electronics Engineering Research (JEEER), Academic Journals and Journal of Engineering, Design and Technology (JEDT), Emerald.

Manoj Kumar Majumder, Research Scholar, is currently pursuing his PhD from Indian Institute of Technology, Roorkee, India. Prior to this, he completed his BTech from Dr. B. C. Roy Engineering College, Durgapur in 2007 and M.Tech from Bengal Engineering and Science University, Shibpur in 2009. He has also worked as lecturer in Department of Electronics and Communication Engineering at Durgapur Institute of Advanced Technology and Management (DIATM), West Bengal. He has one book chapter and several journal and conference publications to his credit.