This book contains extended and revised versions of the best papers that were presented during the fourteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 14th conference was held at the Hotel Boscolo, Nice, France (October 16-18, 2006). Previous conferences have taken place in Edinburgh, Trondheim, Vancouver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt and Perth. The purpose of this conference, sponsored by IFIP TC 10 Working Group 10.5 and by the IEEE Council on Electronic Design Automation (CEDA), is to provide a forum to exchange ideas and show industrial and academic research results in the field of microelectronics design. The current trend toward increasing chip integration and technology process advancements brings about stimulating new challenges both at the physical and system-design levels, as well in the test of these systems. VLSI- SOC conferences aim to address these exciting new issues.
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This book contains extended and revised versions of the best papers that were presented during the fourteenth edition of the IFIP TC10/WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference.
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Architectures for High Dynamic Range, High Speed Image Sensor Readout Circuits.- Oversampled Time Estimation Techniques for Precision Photonic Detectors.- Innovative Optoeletronic Approaches to Biomolecular Analysis with Arrays of Silicon Devices.- Electronic Detection of DNA Adsorption and Hybridization.- Probabilistic amp; Statistical Design—the Wave of the Future.- A CMOS Mixed-Mode Sample-and-Hold Circuit for Pipelined ADCs.- Probabilistic Design: A Survey of Probabilistic CMOS Technology and Future Directions for Terascale IC Design.- Reliability Issues in Deep Deep Submicron Technologies: Time-Dependent Variability and its Impact on Embedded System Design.- Soft Error Resilient System Design through Error Correction.- Library Compatible Variational Delay Computation.- A Power-Efficient Methodology for Mapping Applications on Multi-Processor, System-on-Chip Architectures.- Frequency and Speed Setting for Energy Conservation in Autonomous Mobile Robots.- Configurable On-Line Global Energy Optimization in Multi-Core Embedded Systems Using Principles of Analog Computation.- Logic Synthesis of EXOR Projected Sum of Products.- A Method for I/O Pins Partitioning Targeting 3D VLSI Circuits.- CAT Platform for Analogue and Mixed-Signal Test Evaluation and Optimization.- Broadside Transition Test Generation for Partial Scan Circuits through Stuck-at Test Generation.- Comparison of an Æthereal Network on Chip and Traditional Interconnects - Two Case Studies.- Designing Routing and Message-Dependent Deadlock Free Networks on Chips.- Dynamic Reconfigurable Architecture Exploration based on Parameterized Reconfigurable Processor Model.- Human++: Emerging Technology for Body Area Networks.
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International Federation for Information Processing

The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication.  The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction.  Proceedings and post-proceedings of referred international conferences in computer science and interdisciplinary fields are featured.  These results often precede journal publication and represent the most current research.  The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing.

 

For more information about the 300 other books in the IFIP series, please visit www.springer.com.

 

For more information about IFIP, please visit www.ifip.org.

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Most recent volume from the VLSI C Conference Series”
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Produktdetaljer

ISBN
9780387749082
Publisert
2007-11-15
Utgiver
Vendor
Springer-Verlag New York Inc.
Høyde
235 mm
Bredde
155 mm
Aldersnivå
Research, UP, P, 05, 06
Språk
Product language
Engelsk
Format
Product format
Innbundet