The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. This second edition has been updated to introduce recent advancements in the understanding of the physical process of electromigration, which gives the reader the knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
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The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration.
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Introduction.- Fundamentals of Electromigration.- Integrated Circuit Design and Electromigration.- Mitigating Electromigration in Physical Design.- Summary and Outlook.
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. This second edition has been updated to introduce recent advancements in the understanding of the physical process of electromigration, which gives the reader the knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.   Contents Introduction – Fundamentals of Electromigration – Integrated Circuit Design and Electromigration – Mitigating Electromigration in Physical Design – Summary and Outlook   “This improved, second edition of the book provides the fundamental science necessary for a sound grounding from which to make practical use of the complete and indispensable application-oriented information regarding the electromigration-aware design of electronic systems. It is a foundational reference for today’s design professionals, as well as for the next generation of engineering students.”   Prof. Worthy Martin, Emeritus Associate Professor of Computer Science, University of Virginia   “This is a long-awaited book bridging the design and reliability methodologies imperative for generating robust and high-performing semiconductor devices. A deep insight into physics of the electromigration induced degradation of on-chip interconnect components as well as explaining a design specific failure development are beneficial for both the chip-design and materials engineering communities.”   Dr. Valeriy Sukharev, Chief Scientist, Siemens EDA   “This book summarizes our current understanding of electromigration and how its effects can be moderated in practice. Particularly important and valuable are techniques that can address electromigration in modern automated design flows.”   Dr. Igor Markov, Distinguished Architect, Synopsys, Inc.
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Enables readers to understand and meet challenges of electromigration, including its effects on circuit reliability Accessible to readers of varying backgrounds, combining practical application with theoretical underpinnings Multiple examples and hands-on instructions for the practical application of counter measures
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Produktdetaljer

ISBN
9783031800221
Publisert
2025-03-04
Utgave
2. utgave
Utgiver
Vendor
Springer International Publishing AG
Høyde
235 mm
Bredde
155 mm
Aldersnivå
Professional/practitioner, P, 06
Språk
Product language
Engelsk
Format
Product format
Innbundet

Biographical note

Jens Lienig is the director of the Institute of Electromechanical and Electronic Design at Dresden University of Technology, Germany. He received his Ph.D. in the field of computer-aided physical design of multi-chip modules and was employed as a researcher at University of Virginia, Charlottesville and Concordia University, Montreal. Afterwards he worked as project manager at Tanner Research, Inc. and Robert Bosch GmbH.

Susann Rothe is a scientific assistant at Dresden University of Technology, Germany. She is working towards her Ph.D. in the field of migration modeling and verification with physics-based models. Her research interests include technology characterization and temperature effects for interconnect reliability.

Matthias Thiele is a scientific assistant at Dresden University of Technology, Germany. He received his Ph.D. in the field of electromigration avoidance in physical design. Currently he works on the reliability of electronic, mechatronic and photonic systems.