PrefaceSmartSiC™ Substrates: A Boon to Drain Metallization ProcessSurface Structuring of Patterned 4H-SiC Surfaces Using a SiC/Si/SiC Sandwich ApproachHYPREZ Wafering Solutions: A Novel Approach of SiC Wafering SolutionPoly-SiC Characterization and Properties for SmartSiC™Application of Advanced Characterization Techniques to SmartSiC™ Product for Substrate-Level Device Performance OptimizationA Novel Approach for Thin 4H-SiC Foil Realization Using Controlled Spalling from a 4H-SiC WaferHigh-Temperature Reorganization Behavior of Single-Crystalline Porous 4H-SiC Thin FoilsDicing Process for 4H-SiC Wafers by Plasma Etching Using High-Pressure SF6 Plasma with Metal MasksInvestigations on the Recovery of the Electrical Properties of Smart Cut™-Transferred SiC Thin Film Using SiC-on-Insulator StructuresDemonstration of SiC-on-Insulator Substrate with Smart Cut™ Technology for Photonic ApplicationsA Novel Contactless SiC Wafer Planarization Processing after Mechanical Slicing by Dynamic Thermal Annealing ProcessesProposal of Damage-Free SiC Wafer Dicing Using Water Jet Guided LaserIn-Line Charaterization of HPSI SiC Wafers Using High Resolution Surface Photovoltage Spectroscopy (HR-SPS)Characterization of Very Thin 3C-SiC Epilayers on Si