This special edition contains a series of articles on research results in areas of structural metal materials, and materials for applications in opto- and microelectronics and power electronic devices based on silicon carbide. The presented edition will be helpful to many specialists whose activity is related to machinery and the electronic industry.
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Special topic volume with invited peer-reviewed papers only
PrefaceChapter 1: Properties and Processing Technologies of Structural MetalsInfluence of Tool Eccentricity pin Positioning on AA6061 Aluminium Alloy Friction Stir WeldsCylindrical Billet Size Optimization for Hot Closed-Die Forging of the Upper Ball JointEffect of Melting Temperature and Flux on Slag Percentage in Die Casting Process of Zamak3 AlloyRoughness Test of Aluminum A5052 before and after Forming by SPIF ProcessModelling of Creep Rupture in Grade 92 Steel Using a Microstructure-Type Finite Element MeshAg Powder Production Using Wire Arc Spray TechniqueChapter 2: Optical and Electronic MaterialsUsing the Rods as Collector and Study of its Effect on Morphology and Uniformity of Nanofibers via ElectrospinningRapid Thermal Annealing Process Toward Enhancement of ITO Thin FilmsFabrication of PS/Al Nanocomposites as Foils and Evaluation of their Optical PropertiesNearly Zero Ultra-Flattened Dispersion in Octagonal Photonic Crystal FiberImpacts of Wafer Doping Type on Structural and Optical Properties of Black Silicon Fabricated by Metal-Assisted Chemical EtchingRay Tracing of Perovskite Thin Films for Solar WindowsStudy of Porous III-V Surface Structure via Etching Process: Effect of Pore DepthChapter 3: Research and Optimisation Devices Based on Silicon CarbideA Fully Self-Aligned SiC Trench MOSFET with 0.5 μm Channel PitchHighly Efficient Floating Field Rings for SiC Power Electronic Devices - A Systematic Experimental StudyFabrication of an Open Gate-4H-SiC Junction Field Effect Transistor for Bio-Related and Chemical Sensing ApplicationsTailoring the Charge Carrier Lifetime Distribution of 10 kV SiC PiN Diodes by Physical Simulations10kV+ Rated SiC n-IGBTs: Novel Collector-Side Design Approach Breaking the Trade-Off between dV/dt and Device EfficiencyA Scalable SPICE Electrothermal Compact Model for SiC MOSFETs: A Comparative Study between the LEVEL-3 and the BSIM
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Produktdetaljer
ISBN
9783036403281
Publisert
2023-06-23
Utgiver
Vendor
Trans Tech Publications Ltd
Vekt
400 gr
Høyde
240 mm
Bredde
170 mm
Dybde
8 mm
Aldersnivå
P, 06
Språk
Product language
Engelsk
Format
Product format
Heftet
Antall sider
152