Explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. This book presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels.

1 Overview of Design, Manufacture, and Reliability.- 1.1 Production and Manufacturing Issues.- 1.2 Taguchi Method in Quality Engineering.- 1.3 Manufacturing Design and Reliability.- 1.4 Reliability Standards.- 1.5 Conclusions.- 2 Integrating Reliability into Microelectronics Manufacturing.- 2.1 Microelectronics Manufacturing.- 2.2 New Techniques for Reliability Improvement.- 2.3 Manufacturing Yield and Reliability.- 2.4 Conclusions.- 3 Basic Reliability Concept.- 3.1 Elements of Reliability.- 3.2 Some Useful Life Distributions.- 3.3 Strength and Stress Analysis.- 3.4 Multicomponents Systems.- 3.5 Conclusions.- 4 Yield and Modeling Yield.- 4.1 Definitions and Concept.- 4.2 Yield Models.- 4.3 Yield Prediction.- 4.4 Yield Estimation.- 4.5 Fault Coverage and Occurrence.- 4.6 Yield-reliability Relation Model.- 4.7 Cost Model.- 4.8 Conclusions.- 5 Reliability Stress Tests.- 5.1 Accelerated Life Tests.- 5.2 Environmental Stress Screening (ESS).- 5.3 Failures and Reliability Prediction.- 5.4 Conclusions.- 6 Burn-in Performance, Cost, and Statistical Analysis.- 6.1 Design of Burn-in.- 6.2 Performance and Cost Modeling.- 6.3 Burn-in Optimization.- 6.4 Statistical Approaches for Burn-in Analysis.- 6.5 Conclusions.- 7 Nonparametric Reliability Analysis.- 7.1 The Proportional Hazard Rate Model.- 7.2 The Life Table Estimator (LTE).- 7.3 The Kaplan-Meier Product Limits Estimator.- 7.4 Goodness-of-fit (GOF) Tests.- 7.5 Smoothing Techniques.- 7.6 Conclusions.- 8 Parametric Approaches To Decide Optimal System Burn-in Time.- 8.1 A Time-independent Model.- 8.2 A Time-dependent Model.- 8.3 Conclusions.- 9 Nonparametric Approach and Its Applications to Burn-in.- 9.1 Introduction.- 9.2 Methods.- 9.3 Applications.- 9.4 Conclusions.- 10 Nonparametric Bayesian Approach for Optimal Burn-in.- 10.1The Dirichlet Distribution.- 10.2 The Model Formulation.- 10.3 Other Considerations.- 10.4 Conclusions.- 11 The Dirichlet Process for Reliability Analysis.- 11.1 Method.- 11.2 Variance Reduction in the Dirichlet Process.- 11.3 Determining Optimal Burn-in Time Using the Dirichlet Process.- 11.4 Conclusions.- 12 Software Reliability and Infant Mortality Period of the Bathtub Curve.- 12.1 Basic Concept and Definitions.- 12.2 Stochastic Software Reliability Models.- 12.3 The Non-stochastic Software Reliability Models.- 12.4 A Proposed Procedure of Testing Data.- 12.5 Software Reliability Management.- 12.6 Conclusions.- Epilogue: Cost-effective Design for Stress Burn-in.- References.- Appendices.- A Notation and Nomenclature.- B Failure Modes for Parts.- C Common Probability Distributions.- C.1 Discrete Distributions.- C.2 Continuous Distributions.- D Simulation for U-shaped Hazard Rate Curves.- D.1 Generating U-shaped Hazard Rate Curves.- D.2 Simulation.- E Sample Programs.- E.1 A Sample GINO Program.- E.2 A Sample GAMS program.